Ceramic substrate refers to a special process plate in which copper foil is directly bonded to the surface (one or two sides) of alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate at high temperature. The ultra-thin composite substrate has excellent electrical insulation performance, high thermal conductivity, excellent solderability and high adhesion strength. It can etch various patterns like PCB and has great current carrying capacity. Therefore, ceramic substrate has become the basic material of high-power power electronic circuit structure technology and interconnection technology.
The advent of ceramic substrate products has opened a new development in the heat dissipation application industry. Due to the heat dissipation characteristics of ceramic substrates and the advantages of ceramic substrates such as high heat dissipation, low thermal resistance, long service life and voltage resistance, with the improvement of production technology and equipment, the rationalization of product prices has accelerated, which has expanded the application fields of LED industry, such as indicator lights of household electrical products, car lights, street lights and large outdoor billboards. The successful development of ceramic substrate provides better services for indoor lighting and outdoor lighting products, and makes the future market field of LED industry broader.
characteristic
◆ strong mechanical stress and stable shape; High strength, high thermal conductivity and high insulation; Strong adhesion and anti-corrosion.
◆ good thermal cycle performance, with 50000 cycles and high reliability.
◆ like PCB board (or IMS substrate), it can etch the structure of various graphics; No pollution and pollution.
◆ operating temperature range: - 55 ℃ ~ 850 ℃; The coefficient of thermal expansion is close to silicon, which simplifies the production process of power module.
Superiority
◆ the thermal expansion coefficient of ceramic substrate is close to that of silicon chip, which can save transition layer Mo chip, save labor, materials and reduce cost;
◆ reduce welding layer, reduce thermal resistance, reduce cavity and improve yield;
◆ under the same current carrying capacity, the line width of 0.3mm thick copper foil is only 10% of that of ordinary printed circuit board;
◆ excellent thermal conductivity makes the package of the chip very compact, which greatly improves the power density and improves the reliability of the system and device;
◆ ultra thin (0.25mm) ceramic substrate can replace BeO without environmental toxicity;
◆ large current carrying capacity, 100A current continuously passes through 1mm wide and 0.3mm thick copper body, and the temperature rise is about 17 ℃; 100A current continuously passes through 2mm wide and 0.3mm thick copper body, and the temperature rise is only about 5 ℃;
◆ low thermal resistance, 10 × The thermal resistance of 10mm ceramic substrate is 0.63mm, 0.31k/w, 0.38mm and 0.14k/w respectively.
◆ high insulation and withstand voltage to ensure personal safety and equipment protection ability.
◆ new packaging and assembly methods can be realized to make the products highly integrated and reduce the volume.
performance requirement 
(1) Mechanical properties
It has high enough mechanical strength and can be used as supporting components in addition to carrying components; Good machinability and high dimensional accuracy; Easy to realize multi-layer; The surface is smooth without warpage, bending, microcrack, etc.
(2) Electrical properties
High insulation resistance and insulation failure voltage; Low dielectric constant; Low dielectric loss; Under the condition of high temperature and high humidity, the performance is stable to ensure reliability.
(3) Thermal properties
High thermal conductivity; The coefficient of thermal expansion shall match with relevant materials (especially the coefficient of thermal expansion of Si); Excellent heat resistance.
(4) Other properties
Good chemical stability; Easy metallization, strong adhesion between circuit graphics and them; No moisture absorption; Oil and chemical resistance; A. low radiation emission; The materials used are pollution-free and non-toxic; The crystal structure does not change within the service temperature range; Abundant raw materials; Mature technology; Easy to manufacture; The price is low.
Use
◆ high power semiconductor module; Semiconductor cooler and electronic heater; RF power control circuit, power hybrid circuit.
◆ intelligent power module; High frequency switching power supply, solid state relay.
◆ automotive electronics, aerospace and military electronic components.
◆ solar panel module; Telecommunication private exchange, receiving system; Laser and other industrial electronics.
Trend
The advent of ceramic substrate products has opened the development of heat dissipation application industry. Due to the heat dissipation characteristics of ceramic substrate and the advantages of ceramic substrate such as high heat dissipation, low thermal resistance, long service life and voltage resistance, with the improvement of production technology and equipment, the rationalization of product prices has accelerated, so as to expand the application fields of LED industry, such as indicator lights of household electrical products, car lights, street lights and large outdoor kanban. The successful development of ceramic substrate will provide services for indoor lighting and outdoor lighting products, and expand the market field of LED industry in the future.