Advanced Higher Modulus Material for PKG Substrate
Characteristic
Tg¡Ý270¡æ(DMA)£¬Td>400¡æ(5% loss, TGA) Higher Flexural Modulus Lower X, Y / Z-axis CTE
Halogen-free compatible with lead-free
Application Area
eMMC, DRAM ,AP, PA,Dual CM ,Fingerprint, RFModule, etc.
| Items | Condition | Unit | SI10US |
|---|---|---|---|
| Tg | DMA | ¡æ | 280 |
| Td | 5% wt. loss |
¡æ |
£¾400 |
| CTE (X/Y-axis) | Before Tg |
ppm/¡æ |
10 |
|
CTE (Z-axis) |
¦Á1/¦Á2 |
ppm/¡æ |
25/135 |
| Dielectric Constant 1) (1GHz) | 2.5.5.9 | - | 4.4 |
|
Dissipation Factor 1) (1GHz) |
2.5.5.9 | - | 0.007 |
| Peel Strength1) | 1/3 OZ, VLP Cu |
N/mm |
0.80 |
| Solder Dipping | @288¡æ | min | >30 |
| Young's modulus | 50¡æ | GPa | 26 |
|
Young's modulus |
200¡æ |
GPa |
23 |
| Flexural Modulus1) |
50¡æ |
GPa |
32 |
|
Flexural Modulus1) |
200¡æ |
GPa |
27 |
|
Water Absorption1) |
A | % | 0.14 |
| Water Absorption1) | 85¡æ/85%RH£¬168Hr |
% |
0.35 |
|
Flammability |
UL-94 |
Rating |
V-0 |
| Thermal Conductivity | - | W/(m.K) | 0.61 |
| Color | - | - | Black |
Remarks:
*Specimen thickness: 0.10mm. Test method is according to IPC-TM-650.
*1): specimen thickness: 0.80mm.
All the typical value listed above isfor your reference only, please turn to Shengyi Technology Co.,Ltd. fordetailed information, and all rights from this data sheet are reserved byShengyi Technology Co.,Ltd.
